Download E-books The Art of Software Thermal Management for Embedded Systems PDF

By Mark Benson

This booklet introduces software program Thermal administration (STM) as a way of decreasing energy intake in a computing procedure with the intention to deal with warmth, enhance part reliability and bring up approach safety. Readers will make the most of this pragmatic consultant to the sector of STM for embedded platforms and its catalog of software program strength administration techniques. Since thermal administration is a key bottleneck in embedded structures layout, this publication specializes in root reason behind warmth in embedded structures: energy. considering the fact that software program has a huge impression on strength intake in an embedded procedure, this e-book urges software program engineers to regulate warmth successfully by means of figuring out, categorizing and constructing new how one can lessen static and dynamic strength intake. while so much books on thermal administration describe mechanisms to take away warmth, this booklet makes a speciality of methods for software program engineers to prevent producing warmth within the first place.

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39 forty two forty three Roots: A Bedrock of Giants . . . . . . . . . . . three. 1 Computation . . . . . . . . . . . . . . . . . . three. 2 Thermodynamics . . . . . . . . . . . . . . . three. three Electronics . . . . . . . . . . . . . . . . . . . three. four Dynamic Scaling . . . . . . . . . . . . . . . three. four. 1 courting of warmth to energy. three. four. 2 Traversing the Curve . . . . . . . three. four. three relocating the Curve . . . . . . . . . three. four. four discovering substitute Curves . . . three. five Case research: Amazon Kindle fireplace . . . . three. five. 1 below Load. . . . . . . . . . . . . . three. five. 2 Idle Mode . . . . . . . . . . . . . . . three. five. three Voltage Tuning . . . . . . . . . . . three. five. four Wake Time . . . . . . . . . . . . . . References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . forty seven forty seven forty eight fifty three fifty seven fifty seven fifty nine sixty five sixty six sixty seven sixty eight 70 seventy two seventy three seventy five four options: placing the Silicon to paintings. . . . four. 1 Silicon Fabrication developments . . . . . . . . . . four. 2 Dynamic Voltage and Frequency Scaling four. 2. 1 Voltage Slew. . . . . . . . . . . . . . . four. 2. 2 Sequencing . . . . . . . . . . . . . . . . four. three Adaptive Voltage Scaling . . . . . . . . . . . four. three. 1 Open-Loop . . . . . . . . . . . . . . . . four. three. 2 Closed-Loop . . . . . . . . . . . . . . . four. four Clock and tool Gating . . . . . . . . . . . . four. four. 1 Clock Gating. . . . . . . . . . . . . . . four. four. 2 strength Gating . . . . . . . . . . . . . . four. five Static Leakage administration . . . . . . . . . References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . seventy nine seventy nine eighty one eighty two eighty three eighty five 86 87 88 88 89 ninety one ninety two five Frameworks: Choreographing the components . . . . . . . . . . . . five. 1 software program Coordination . . . . . . . . . . . . . . . . . . . . . five. 1. 1 complex energy administration . . . . . . . . . . five. 1. 2 complicated Configuration and gear Interface five. 2 Thermal administration Framework . . . . . . . . . . . . . five. 2. 1 source supervisor . . . . . . . . . . . . . . . . . . . five. 2. 2 coverage supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ninety five ninety five ninety six ninety eight ninety nine a hundred one zero one three half II . . . . . . . . . . . . . . . Catalog Contents five. 2. three Mode supervisor . . . . . . . . . five. 2. four garage supervisor . . . . . . . . five. three Case examine: Linux . . . . . . . . . . . . five. three. 1 approach strength administration five. three. 2 machine strength administration. References . . . . . . . . . . . . . . . . . . . . . . xiii . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 106 107 108 111 114 Frontiers: the way forward for software program Thermal administration . 6. 1 Predictive Stochastic strategies . . . . . . . . . . . . . . . . . 6. 2 Thermal administration instruments for software program Engineers . . 6. three Benchmarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6. four Thermal administration Frameworks. . . . . . . . . . . . . . . References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . one hundred fifteen one hundred fifteen 116 117 118 118 Appendix A: Checklists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Acronyms ACM ACPI ADC AE AF AMD AMP AMR APM AV AVS AWB CAD CAGR CG CMOS CODEC CPU DAC DARPA DDR DFS DMA DMIPS DPM DPS DPTC DRAM DSP DVFS DVS EEPROM FSM GUI HW organization for Computing equipment complex Configuration and gear Interface Analog to electronic Converter vehicle publicity car concentration complicated Micro units uneven Multiprocessing Absolute greatest score complex energy administration Audio visible Adaptive Voltage Scaling car White stability Computer-Aided layout Compound Annual development expense Clock Gate Complementary Metal-Oxide Semiconductor Portmanteau of Coder-Decoder crucial Processing Unit electronic to Analog Converter Defence complex study tasks supplier Double information cost SDRAM Dynamic Frequency Scaling Direct reminiscence entry Dhrystone Million directions in keeping with moment Dynamic strength administration Dynamic energy Switching Dynamic strategy Temperature reimbursement Dynamic Random entry reminiscence electronic sign Processor Dynamic Voltage and Frequency Scaling Dynamic Voltage Scaling Electrically Erasable Programmable Read-Only reminiscence Finite nation computing device Graphical person Interface undefined xv xvi IC IEC IEEE IP ISP MCU MPEG NJTT NTI OEM OMAP OPP OS laptop PCB PDA PM PMIC PWM RAM RF ROC RTC SD SDR SLM SMP SOC SPI SDRAM STM SW TDP TGP TMT TRM television UART UML USB VDD VLSI Acronyms built-in Circuit foreign Electrotechnical fee Institute of electric and Electronics Engineers highbrow estate photograph sign Processor Microcontroller Unit relocating photograph specialists staff Near-Junction Thermal delivery Nano-Thermal Interfaces unique gear producer Open Multimedia purposes Platform working functionality aspect working method computer published Circuit Board own electronic Assistant strength administration strength administration built-in Circuit Pulse-Width Modulation Random entry reminiscence Radio Frequency suggested working stipulations Real-Time Clock safe electronic Software-Defined Radio Static Leakage administration Symmetric Multiprocessing approach on Chip Serial Peripheral Interface Synchronous Dynamic Random-Access reminiscence software program Thermal administration software program Thermal Dynamic strength Thermal flooring aircraft Thermal administration applied sciences Technical Reference guide tv common Asynchronous Receiver/Transmitter Unified Modeling Language common Serial Bus confident provide Voltage Very Large-Scale Integration Part I beginning Thermal functionality is the recent bottleneck in embedded structures layout.

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